Silicon Through Holes

• Si Wafer

• Thickness: 0.54 mm

• Hole diameter: 25µm

• Hole pitch: 50µm

• Process time: 0.65s

• Silicon Carbide Wafer

• Thickness: 0.64mm

• Through Hole: 130x500µm

• In width: 130µm

• Out width: 110µm

• Aluminum Nitride

• Thickness: 425µm

• In side width: 300µm

• Out side width: 290µm

• Drilling time: 33s

• Cu-FR4 sandwich

• Thickness: 0.5mm 

• Hole dimension: 200µm

• Process time: 3.3s

• Stainless Steel Sheet

• Thickness: 120µm

• Hole diameter: 9µm

• Hole pitch: 50µm

• Matrix Process time: 0.15s