Milling and Cutting (MICROTAGLIO)
with YFLS-OEM LASER SYSTEM

Silicon Milling

  • Si Wafer

  • Thickness: 0.54 mm

  • Trench length: 3mm

  • Trench width: 100µm

  • Trench pitch: 250µm

  • Process time: 140s
Solar Cell Cutting

  • Materials: Si,a-Si, GaAs

  • Thickness: up to 600µm 

  • Photo: GaAs/Ge

  • Thickness: 125µm

  • Cut width: <20µm

  • Cutting speed: 50mm/s

YFLS OEM System is a compact, reliable and cost effective laser micro-machining and marking system. Its high resolution, reliability, flexibility, speed, repeatability applied over a wide range of materials (metals, alloys, coated metals, ceramics, semiconductors, etc..), makes the LaserPoint YFLS laser Micro-Machining & Marking system “first in class” among all the existing laser marking systems.

YFLS OEM System is available in two models: 0.5mJ and 1.0mJ Q-switched fiber laser with different scan head options with wide FL range and working areas to customise and optimise the system for several applications. The output fiber can be made as long as 10m, so that the scan head can be located remotely respect to the laser head if needed.

Ulteriori note applicative

   

LaserPoint srl
via Burona 51 - 20090 Vimodrone (Milano)
T: 02-27400236 F: 02-25029161

      

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